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PRODUCT DETAIL
SOD3588S-M
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  • LPDDR4 4G/8G/16G
    RAM
    LPDDR4 4G/8G/16G
  • WIFI6 802.11a/b/g/n/ac/ax,Bluetooth5.0
    Connectivity
    WIFI6 802.11a/b/g/n/ac/ax,Bluetooth5.0
  • 2 x UART, one for debug (4Pin-PH1.25)<br>2 x Speaker Interface, 10W (2Pin-PH1.25)<br>1 x Mic connector (2Pin-PH1.25)<br>1 x Key connector (4Pin-PH1.25)<br>1 x TP-CoF/NFC connector (10Pin-FPC-0.5mm)<br>1 x RTC Battery connector (2Pin-PH1.25)
    Interface
    2 x UART, one for debug (4Pin-PH1.25)
    2 x Speaker Interface, 10W (2Pin-PH1.25)
    1 x Mic connector (2Pin-PH1.25)
    1 x Key connector (4Pin-PH1.25)
    1 x TP-CoF/NFC connector (10Pin-FPC-0.5mm)
    1 x RTC Battery connector (2Pin-PH1.25)
  • SPECIFICATION
OS Android/Linux
SOC RK3588S, 4 x Cortex-A76 + 4 x Cortex-A55 2.4GHz, 8nm
GPU ARM Mali-G610 MP4 Quad-Core
OpenGL ES3.2/OpenCL 2.2/Vulkan1.1,450 GFLOPS
6.0TOPS NPU, Support INT4/INT8/INT16
RAM LPDDR4 4G/8G/16G
ROM EMMC5.1 64G/128G/256G
Media Decode:
8K 60fps H.265NP9/AVS2
8K 30fps H.264AVC/MVC
4K 60fps AV1
1080P 60fps MPEG-2/-1/C-1P8

Encoded:
8K 30fps encoding,
Support H.265/H.264 Up to 32-channel
1080P 30fps decoding and 16-channel
1080P 30fps encoding
Display 1 x MIPI-DSI (1920x1200@60fps)
1 x eDP1.3 (4K@60fps)
1 x HDMI2.1 (8K@60fps or 4K@120fps, either HDMI output or eDP display)
1 x DP1.4 (4K@60fps, multiplexed with Type-C USB 3.0)
LTE External 4G module
Ethernet 1000M Ethernet x 1
Connectivity WIFI6 802.11a/b/g/n/ac/ax,Bluetooth5.0
USB 1 x Type-C,USB3.2 gen1,with OTG & DP-out(30Pin-FPC-0.5mm)
1 x USB3.0 /SATA3.0 (30Pin-FPC-0.5mm)
2 x USB Host 2.0(2 x 4Pin-PH1.25)
Audio Speaker x 2
Microphone x 1
Interface 2 x UART, one for debug (4Pin-PH1.25)
2 x Speaker Interface, 10W (2Pin-PH1.25)
1 x Mic connector (2Pin-PH1.25)
1 x Key connector (4Pin-PH1.25)
1 x TP-CoF/NFC connector (10Pin-FPC-0.5mm)
1 x RTC Battery connector (2Pin-PH1.25)
Input Power VSYS-4V+5V+12V Power Supply
(nterface board can be flexibly designed according to the demand for power supply solutions,DC supply voltage wide voltage, whether the battery, single and double battery, fast charging, etc.)
PCB Size: 63 x 93 x 1.2mm
Process: 8-layers HDI-2 Immersion Gold
Environment Operating temperature -20°C ~ 60°C
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